Addressing Off-Centered Ball through Solder Paste Material Evaluation | Journal of Engineering Rese

One of the most difficult operations in semiconductor assembly manufacturing is stencil printing with solder paste material. An off-centered ball issue was discovered during the examination of a semiconductor device. The goal of the research was to see how different solder paste ingredients affected off-centered balls during the stencil printing process. The same reflow condition was used to cure both solder paste compositions. However, solder paste substance 1 (S1) produced cold solder junctions, but solder paste material 2 (S2) produced cured solder paste. The occurrence of off-centered balls was subsequently eradicated with the use of S2 material in stencil printing. The solder paste substance and arrangement could be used in future projects for devices with similar requirements.

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