Flux Shorting Mitigation on Semiconductor BGA Device through Process Design Enhancement | ...

Because of the inherent issues that come with new and upcoming semiconductor technologies, packages like the ball grid array (BGA) are becoming more difficult to process. One way to increase efficiency during assembly manufacturing is to change the process by changing the design of indirect material. In this article, we will look at An improved dipping plate design is presented to address the issue of flux shorting caused by an out-of-specs dipping plate during the ball attach operation. A side-by-side comparison was used in the analysis to show that the new design is superior to the out-of-specs indirect material. Flux shorting was reduced thanks to a new improved dipping plate design and an optimised flux depth parameter mitigated successfully.

Please see the link - https://www.journaljerr.com/index.php/JERR/article/view/17231