Multi-Hole Process Plate Modification for Chip on Lead Device at Die Attach Process | Journal of En

The paper focused on improvements made in chip on lead (COL) leadframe package assembly manufacturing to fix leadframe bouncing during the die attach phase. A new and improved process plate with a multi-hole configuration is designed to provide a good vacuum underneath the leadframe and preserve planarity during silicon die dispensing and die bonding onto the leadframe. Leadframe bouncing was successfully removed during the die connect phase with the new multi-hole process plate. The multi-hole process plate could be used on devices with similar configurations in the future.

Please see the link :- https://www.journaljerr.com/index.php/JERR/article/view/17208