Specialized EMI Shielding Process for Semiconductor Package | Journal of Engineering Research and ..

Electromagnetic interference (EMI) is an unintended disruption induced by outside sources that interferes with a device's electrical functionality. This paper describes an advanced approach to EMI shielding for sensitive and critical semiconductor packages. The EMI coating was applied to the upper-half portion of the device using a half-cutting method, shielding the Silicon die and internal components from external EMI disruption. Eventually, the improved EMI shielding method will provide quality benefits and eliminate the possibility of EMI. Although providing the primary purpose of EMI safety for semiconductor devices, potential assembly issues can arise. The technique may be used on packages with similar requirements in future studies. Prototypes are useful for validating the improved process' efficacy.

Please see the link - https://www.journaljerr.com/index.php/JERR/article/view/17238