Wirebond Process Optimization through Stitch Relocation on QFN Package | Journal of Engineering ...

Wirebonding, which uses a wire as a direct material, is one of the most difficult assembly manufacturing processes in the semiconductor industry. During the first trial of a quad flat no-leads (QFN) kit using this new technology, some issues were discovered. The heal crack seen on the stitch formation during the second bond is the subject of this article. Relocating the stitch formation on the second bond resulted in a significant change. Ultimately, heal crack occurrence was successfully eliminated. Please see the link - https://www.journaljerr.com/index.php/JERR/article/view/17228