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Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling | Journal of
Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during...
Behaviour of RC Moment Resisting Regular and Irregular Framed Structures Situated Near and Far to Fa
Near fault earthquake record are rich in high frequencies that effects structures for far fault earthquake record lower frequencies is...
A Study of Micro-crack on Surface Mount IC Package
In integrated circuit (IC) manufacturing industry, package micro-crack and other crack-related flaws are common defect frequently...
Specialized Wirebond Process Configuration on Advanced Multi-Die Package
Wirebonding process is one important assembly process responsible for providing electrical connections between the silicon die and the...
Environmental Impact of Open Burning of Municipal Solid Wastes Dumps in Parts of Jos Metropolis, Nig
Refuse dumpsites are found scattered within and outside cities in Nigeria and the open burning of these dumps is a common practice mainly...
Tool Setup Improvement for Package Scratch Mitigation at End-of-Line Process | Journal of Engineerin
With new and continuous semiconductor technology trends, challenges in assembly manufacturing are inevitable. This paper focused on the...
RF Matching Networks Using S-Parameters | Journal of Engineering Research and Reports
The paper presents a design and study of impedance matching for radio frequency (RF) circuit application of common-source amplifier...
Optimization of the Operational Conditions for Low-Head Pelton Wheel Turbine Developed for Power Gen
In a bid to optimize the performance of a Pelton Wheel Turbine developed the performance evaluation of the turbine at various conditions...
Wirebond Process Improvement through Silicon Die Polyimide Removal | Journal of Engineering Research
This study aims to develop polyimide etching process on the silicon die after decapsulation to resolve the wire shear issue during ball...
Modified Sidewall Design of QFN Package
The paper offers an improvement for leadframe devices to mitigate the occurrence of package chipping rejection during package mechanical...
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